PRODUCTS

FLA-200
Wafer flatness measurement system

Selling Points

MULTI POINT

Non-Contact type

PC & Software

Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)
Measures all materials including Si, GaAs, Ge, InP, SiC
Full 500 micron thickness measurement range without re-calibration
2-D /3-D Mapping software

Details

Applications

• Semiconductor materials, Solar-cell materials (Silicon, Polysilicon, SiC etc)
• Silicon-related epitaxial materials, Ion-implantation sample
• Chemical compound semiconductor (GaAs Epi, GaN Epi, InP, Ga etc)

Sample sizes

3~8 inch

Measuring range

Thickness: 200 –1200μm
Bow : +/-350μm
Warp: 350μm

Product Information

Products Lineups

• Contact type resistance measurement
• Non-Contact type resistance measurement
• Lifetime measurement
• Flatness/Thickness measurement
• Spreading resistance measurement
• PN type checker
• 4 point probe head
• Resistivity Reference wafer